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1 - NTS Model NBM-SE3-4 Wafer Bonding Machine Wafer Bonding Machine Maker NTS Model NBM-SE3-4 Acquisition Date 2011-06-03 Q’ty 1 EA No˚ of wafer mounting:Ø1inch×6wafer Mounting plate size:O.D Ø248×10mmt Automatic Processing by program...
Semi Materials - Korea
Machinery Marketplace
1 - Bystronic ByStar Fiber 3015 Laser Cutting Hours 4706, Max Laser Power 6kW, Cutting Area 3100 x 1580 x 100 mm, Max Positioning Speed (X and Y) 120 m/min, ByTrans 3015 Extended Automatic Loading
1 - Semi-Automatic Cathode Packaging Line Gorbel 500 Lb Capacity Floor Mounted Jib Crane; Roller Conveyor; Heat Sealer; ULine Strapper; Rail Mounted Electric Hoist
1 - mPLUS Corp MPPA-1622-005A Cell Packaging Machine Pouch Unwinder/Clamp/Feed/Fold; Seal; MKS 600 Series Pressure Controllers; (Qty) Edwards Vacuum Pumps; Domino A Series Plus Printer Coder Control; (Cell Packaging Machine #2)
1 - mPLUS Corp MPPA-1622-005A Cell Packaging Machine Pouch Unwinder/Clamp/Feed/Fold; Seal; MKS 600 Series Pressure Controllers; (Qty) Edwards Vacuum Pumps; Domino A Series Plus Printer Coder Control; (Cell Packaging Machine #3); ID DOE200204
1 - mPLUS Corp MPPA-1622-005A Cell Packaging Machine Pouch Unwinder/Clamp/Feed/Fold; Seal; MKS 600 Series Pressure Controllers; (Qty) Edwards Vacuum Pumps; Domino A Series Plus Printer Coder Control; (Cell Packaging Machine #4); ID DOE_______
1 - mPLUS Corp MPPA-1622-005A Cell Packaging Machine Pouch Unwinder/Clamp/Feed/Fold; Seal; MKS 600 Series Pressure Controllers; (Qty) Edwards Vacuum Pumps; Domino A Series Plus Printer Coder Control; (Cell Packaging Machine #1); ID DOE200239
1 - Ultex UMB-20MZ3000CR-LAB Ultrasonic Metal Bonding Machine Dukane #20kHz  3300W Dynamic Process Controller; Ultec Controller #SID-20MZ-LAB-04, S/N SS005410 (2017)
Complete Anode/Cathode Processing Facility
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